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PCB Fabrication Service

LingtechPCB have top-level equipment and advanced process technology, no matter how complex the PCB,

 

LingtechPCB can quickly provide manufacturing services according to customer requirements.

 

And has a senior engineering technical team,

 

according to the customer’s design to make fabrication  in a low-cost manner

 

Introduction to LingtechPCB Fabrication Service

 

LingtechPCB offers top quality Printing Circuit Boards (PCB) including multi-layer PCB (printed circuit board),

 

high-level HDI(high density inter-connector), arbitrary-layer PCB and rigid-flexible PCB…etc.

 

As a base material, LingtechPCB understands the importance of reliable quality of the PCB.

 

We invest in best equipments and talented team to produce best quality boards.

 

LingtechPCB manufacturing capabilities are shown in the chart below.

 

Type

Capability

Scope

Multilayers(4-70)、HDI(4-48)Flex、Rigid Flex

Double Side

CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Multilayers

4-70 layers, board thickness 8mil-126mil (0.2mm-3.2mm)

Buried/Blind Via

4-48 layers, board thickness 10mil-126mil(0.25mm-3.2mm)

HDI

1+N+1、2+N+2、3+N+3、Any layer

Flex & Rigid-Flex PCB

1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB

Laminate

Soldermask Type(LPI)

Taiyo、Goo’s、Probimer FPC…..

Peelable Soldermask

Carbon ink

HASL/Lead Free HASL

Thickness: 0.5-40um

OSP

ENIG (Ni-Au)

Electro-bondable Ni-Au

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Electro. Hard Gold

Thick tin

Capability

Mass Production

Min Mechanical Drill Hole

0.20mm

Min. Laser Drill Hole

4mil (0.100mm)

Line Width/Spacing

2mil/2mil

Max. Panel Size

21.5″ X 24.5″(546mm X 622mm)

Line Width/Spacing Tolerance

Non electro coating:+/-5um,Electro coating:+/-10um

PTH Hole Tolerance

+/-0.002inch(0.050mm)

NPTH Hole Tolerance

+/-0.002inch(0.050mm)

Hole Location Tolerance

+/-0.002inch(0.050mm)

Hole to Edge Tolerance

+/-0.004inch(0.100mm)

Edge to Edge Tolerance

+/-0.004inch(0.100mm)

Layer to Layer Tolerance

+/-0.003inch(0.075mm)

Impedance Tolerance

+/- 10%

Warpage %

Max≤0.5%

 

     Technology for HDI PCB

 

ITEM

Production

Laser Via Drill/Pad

0.125/0.30 、 0.125/0.38

Blind Via Drill/Pad

0.25/0.50

Line Width/Spacing

0.10/0.10

Hole Formation

CO2 Laser Direct Drill

Build Up Material

FR4 LDP(LDD); RCC 50 ~100 micron

Cu Thickness on Hole Wall

Blind Hole: 10um(min)

Aspect Ratio

0.8 : 1

 

     Technology  for Flexible PCB

 

Project 

Ability

Roll to roll (one side)

YES

Roll to roll (double)

NO

Volume to roll material width mm

250

Minimum production size mm

250×250

Maximum production size mm

500×500

SMT Assembly patch (Yes/No)

YES

Air Gap capability (Yes/No)

YES

Production of hard and soft binding plate(Yes/No)

YES

Max layers(Hard)

10

Tallest layer(Soft plate)

6

Material Science 

PI

YES

PET

YES

Electrolytic copper

YES

Rolled Anneal Copper Foil

YES

PI

Covering film alignment tolerance mm

±0.1

Minimum covering film  mm

0.175

Reinforcement 

PI

YES

FR-4

YES

SUS

YES

EMI SHIELDING

Silver Ink

YES

Silver Film

YES

Copyright 2009 © Shenzhen Lingtech PCB All Rights Reserved
Addr:6 Floor, 2nd Building, Xinghui Industry Zone, Bao’an District, Shenzhen,China,518100
Email: james@6pcb.com
Tel: +86-755-23200509