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Blind Vias Backplane PCB
Blind Vias Backplane PCB

Blind Vias Backplane PCB

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Blind Vias Backplane PCB


BackplanePCB usually used a Printed Circuit Board also have been used in minicomputers and high reliability


applications.To be a group of electrical connector in parallel with each others, each pin in PCB to each connectors


are linked to the same relative pins of all the other connectors forming a internal systems.That is used as a


backbone to connect several PCBs together to make up a complete system.


BackplanePCB is often described as being either active or passive. Active backplanes contain, in addition to the


sockets, logical circuitry that performs computing functions. In contrast, passive backplanes contain almost no


computing circuitry.Traditionally, most PCs have used active backplanes PCB. also including Consumer Electronics


PCB, Indeed, the terms motherboard and backplane have been synonymous. Recently, though, there has been a


move toward passive backplanes, with the active components such as the CPU inserted on an additional card.


Passive backplanes make it easier to repair faulty components and to upgrade to new components.


HCH-PCB service our customers from prototype through mass production in Backplanes PCB, meeting their lead


time to market requirements. No order is too small. We thrive in a high mix, quick turn environment.


Our on-time delivery, for standard as well as complex technology is in the 97% across all industries.


Bling Vias Backplane PCB Capability:


Appearance Standard High Advanved
Layer Count (Max.Layers): 16 40 60+
PCB Size (Max.): 1100mm×500mm 1200mm×500mm 1200mm×630mm
Thickness (Max.): 8mm 10mm 15mm+
Outer Layer Line Width/Space: 0.006〞/0.006〞 0.005〞/0.005〞 0.004〞/0.004〞
Press-fit Hole Size Tolerance +/-2mil +/-2mil +2/-1mil
Through Hole Aspect Ratio: 15:1 17:1 20:1
Drill Registration: +/-5mil +/-4mil +/-3mil
Buried Vias: Yes Yes Yes
Blind Vias: Layers n to n-1 Layers n to n-2 Layers n to n-3


Back Drilling (Counter Bore):


Backplanes boards can endure significant signal integrity disturbances as a result of the unused portions of


through holes and vias that extend past their last connected layer. known as “stubs”. it will lead SI reflections,


capacitance, inductance and impedance discontiunities,losses that become critical as speeds increase.


Relevant Customized Case Recommendation
Production flow chart
Q:What does LingtechPCB do?
A: We’re a globally professional provider integrating PCB solution,PCB design, PCB fabrication, PCB assembly and PCB com...
Q: What are needed for quotation?
A: PCB: Quantity, Gerber file, and Technic requirements(material, surface finish treatment, copper thickness, board thic...
Q: What about OEM and ODM? and what is the MOQ?
A: We accept both OEM and ODM orders. MOQ is 1 pcs.
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