LingtechPCB is equipped with the best new medium/high speed SMT machines, with a daily output of about 6 million
points. In addition to the best machines, our experienced SMT team is also the key to providing the best quality
products. LingtechPCB continues to invest in the best machines and excellent team members.
Our SMT capabilities are:
PCB layer: 1-48 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 6.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.19mm;
Surface mount technology, SMT for short, is an electronic mount technology that mounts resistors, capacitors,
transistors, integrated circuits and other electronic components on a printed circuit board and forms electrical
connections through soldering.
2. The advantage of SMT:
SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, good high-frequency
characteristics,and high production efficiency. SMT occupies a place in the circuit board assembly process.
3. Mainly steps of SMT:
The SMT production process generally includes three main steps: solder paste printing, placement and reflow soldering.
A complete SMT production line including basic equipment must include three main equipment: printing machine, production
line SMT placement machine and reflow soldering machine. In addition, according to the actual needs of different production,
it can also be equipped with wave soldering machines, testing equipment and PCB board cleaning equipment. The design of
SMT production line and equipment selection should combine the actual needs, actual conditions, and adaptability of product
production to produce advanced equipment.
4. Our capacity: 55 sets
Brand: Yamaha, JUKI, Hitachi, Ambian
5. The Difference between SMT & DIP
(1) SMT generally mount lead-free or short lead surface mount components. The solder paste needs to be printed on the PCB,
then mounted by the placement machine, and then fixed by reflow soldering; there is no need to reserve corresponding
through holes for the pins of the components, and the component size of the surface mount technology is much smaller
than the through-hole insertion technology .
(2) DIP soldering is to directly encapsulate the packaged device, which is fixed by wave soldering or manual soldering.