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PCB assembly

LingtechPCB provides rapid and reliable turnkey Electronic Contract Manufacturing (EMS) services.

 

Our one-stop turnkey service cover as everything from electronic design of the circuits, PCB layout, PCB fabrication,

 

component sourcing, parts procurement and PCB assembly. our PCB Assembly services also specialize in prototyping

 

and small-volume production, making  LingtechPCB the one-stop destination of PCBs fabrication and assembly.

 

This services makes your R&D work easy and time-saving. Served thousands of satisfied orders daily all over the

 

world, Due to our reliable quality and excellent service, we have been into one of the best suppliers of PCB and

 

PCBA services in the world.

 

The typical LingtechPCB assembly process are below:

  • IQC

 

  • SPI

 

  • Reflow soldering

 

  • X-RAY (for BGA)

 

  • DIP through hole

 

  • board cleaning

 

  • Function Testing

 

  • package
  • automatic solder paste printing

 

  • SMT

 

  • AOI

 

  • ICT testing

 

  • Wave soldering

 

  • Firmware Programming

 

  • coating (if needed)

 

 

LingtechPCB Assembly capability is shown as below:

 

Supported Capabilities
Types of Assembly SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability PCB layer: 1-60 layers;
PCB material:FR-4,CEM-1, CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 6.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.19mm;
Component Package Reels
Cut tape
Tube and tray
Loose parts and bulk
Board shape Rectangular
Round
Slots and Cut outs
Complex and Irregular
Assembly process Lead-Free (RoHS, REACH)
Design file format Gerber
BOM (Bill of Materials) (.xls,.CSV, . xIsx)
Coordination (Pick-N-Place/XY file)
Electrical testing AOI (Automated Optical Inspection),
X-ray Inspection
ICT (In-Circuit Test)/ Functional testing
Reflow Oven profile Standard
Custom

 

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Addr:6 Floor, 2nd Building, Xinghui Industry Zone, Bao’an District, Shenzhen,China,518100
Email: james@6pcb.com
Tel: +86-755-23200509