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PCB Assembly Service


LingtechPCB provides rapid and reliable turnkey and customized Electronic Contract Manufacturing (EMS) services.


Our one-stop turnkey service cover as everything from electronic design of the circuits, PCB layout, PCB fabrication,


component sourcing, parts procurement and PCB assembly. our PCB Assembly services also specialize in prototyping


and small-volume production, making LingtechPCB the one-stop destination of PCBs fabrication and assembly.


This services makes your R&D work easy and time-saving. Served thousands of satisfied orders daily all over


the world, Due to our reliable quality and excellent service, we have been into one of the best suppliers of PCB and


PCBA services in the world.


The typical PCB assembly process are below:


IQC                                                                Automatic solder paste printing


SPI                                                               SMT


Reflow soldering                                          AOI


X-RAY (for BGA)                                         ICT testing


DIP through hole                                        • Wave soldering


Board cleaning                                           • Firmware Programming


Function Testing                                          Coating (if needed)


LingtechPCB’s advanced assembly equipment enables us to quickly meet all your PCBA needs in a low-cost manner.


LingtechPCB PCB assembly capabilities are as follows:


Supported Capabilities
Types of Assembly SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
SMT capability PCB layer: 1-48 layers;
PCB material:FR-4,CEM-1, CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 6.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.19mm;
Component Package Reels
Cut tape
Tube and tray
Loose parts and bulk
Board shape Rectangular
Slots and Cut outs
Complex and Irregular
Assembly process Lead-Free (RoHS, REACH)
Design file format Gerber
BOM (Bill of Materials) (.xls,.CSV, . xIsx)
Coordination (Pick-N-Place/XY file)
Electrical testing AOI (Automated Optical Inspection),
X-ray Inspection
ICT (In-Circuit Test)/ Functional testing
Reflow Oven profile Standard


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Addr:6 Floor, 2nd Building, Xinghui Industry Zone, Bao’an District, Shenzhen,China,518100
Email: james@6pcb.com
Tel: +86-755-23200509