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Reflow Soldering

The reflow soldering process is an important process to obtain good solder quality. The temperature of the LingtechPCB reflow soldering


machine has 10 temp. zone.We calibrate the temperature to ensure the correct temperature every day.



For the past few years, with the development of electronic products in the direction of small size, light weight, and high density,


reflow soldering is facing great challenges. Reflow soldering requires the use of more advanced heat transfer methods to


achieve energy saving, uniform temperature, and adapt to increasingly complex soldering requirements.




(1) Large temperature gradient, easy to control temperature curve.


(2) The solder paste can be distributed accurately, with less heating times and less possibility to be mixed with impurities.


(3) Suitable for soldering all kinds of high-precision and high-demand components.


(4) Simple process and high soldering quality.



2. Production preparing


  •  First, the solder paste is accurately printed on each board through a solder paste mold.


  •  Second, the component is placed on the board by SMT machine.


  •  Only after these preparations are all prepared, the real reflow soldering begin.


3. Application


    Reflow soldering is suitable for SMT, and works with SMT machine. When components are attached to


    the circuit board,the soldering needs to be completed by reflow heating.

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Addr:6 Floor, 2nd Building, Xinghui Industry Zone, Bao’an District, Shenzhen,China,518100
Email: james@6pcb.com
Tel: +86-755-23200509