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Fibre-Optical Module PCB
Fibre-Optical Module PCB

Fibre-Optical Module PCB

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Fibre-Optical Module PCB


The optical fiber module is an electronic component used for photoelectric conversion. Simply put, optical signals are


converted into electrical signals, and electrical signals are converted into optical signals, including transmitters,


receivers and electronic functional circuits. Therefore, as long as there is a light signal, there are applications of light


chess pieces. Optical fiber modules are divided into optical receiving modules, optical transmitting modules, optical


transceiver-body modules and optical forwarding modules according to their functions.


Design method of fiber optical module PCB.


Panel method


It is recommended for the design of the center mirror symmetrical panel of the miniaturized optical module PCB


Marking point design


It is recommended to place two marking points on the unit board. If the unit board cannot place two marking points,


but at least one marking point can be placed, a marking point without a copper ring can be used. At the same time,


a marking point should be added on the auxiliary side for coordination.


PCB connection method


Milling groove + stamp hole design: milling groove width 2mm, stamp hole is non-metallic, recommended hole


distance 1.0mm, aperture 0.5mm,The center of the seal hole should face the PCB of the optical module.


It is recommended that the distance between the center of the seal hole and the edge of the milling groove is not


less than 0.6mm, which can reduce the burrs on the edge of the optical module PCB and avoid interference with


the shell. V-CUT connection: refer to the general requirements of the PCB process design specification.


Milling groove + physical connection: milling groove width 2mm, actual connection width 2-10mm, cloth forbidden


area 1mm,For panel and auxiliary block connection, punching hole + milling groove is the first choice, followed by


real connection + milling groove, V-CUT connection is not recommended.


Note: In the V-CUT connection mode, the milling cutter splitter is not allowed to split the board, and the hob


splitter is used to split the board, the stress is large, and the optical module layout cannot meet the


prohibition requirements.


PCB process layout requirements


PCB and FPC welding surface area is not allowed to have any equipment optical device welding hot pressing process:


the hot pressing area is 0.5mm larger than the pressing operation area of the hot pressing head, and the hot pressing


area is equal to or greater than the length of the assembly area + 4mm,Optoelectronic devices fixed with screws:


It is forbidden to lay any devices and non-grounded vias within 1.5mm around the body and bottom and 1.5mm


around the fiber sheath. If it is necessary to arrange non-grounded vias, plug holes must be used to increase the


character oil and green, but non-grounded vias must be prohibited at the bottom of the silk screen.


There is a gap of about 0.25 between the screw hole of the optoelectronic device and the screw, and the tolerance


of the device itself is +0.25. When the tolerance of the device chip is added, a 1.5mm cloth ban is required. 


It is forbidden to place vias, test boards and devices around the 1.0mm pads of hand-soldered optical devices. 


If a through hole must be arranged, the through hole must be completely blocked with soldermask. The bright


copper area cannot be directly connected to the pad, and there must be a solder mask in the middle.


The minimum width of the solder mask is 3mil, The arrangement distance between optical devices and between


optical devices and electrical components should meet the operating space requirements of manual welding and


maintenance. The pins of optical devices are basically manual welding, so the layout must meet the requirements


of manual welding, otherwise it is easy to hit Parts, causing difficulties in welding and maintenance. In the layout


of the optical component, the fiber exiting part cannot enter the plugging and unplugging area of the fiber


connector, so as not to break the fiber exiting portion of the optical module pigtail when plugging and


unplugging the connector.


PCB routing design requirements


For the traces connected to the PCB hot rod reflow soldering pads, the recommended line width is 5-10mil; when a


large area is required for grounding, the lead length d≥50mil,Note: According to the test results, if the length of the


large-area grounding lead is too small, the heat transfer is too fast during hot pressing, and the process parameters


are not easy to control, resulting in poor welding. Therefore, it is recommended that the lead length be greater than


50 mils. Thick and long wiring, connection vias, large area copper foil heat dissipation, resulting in uneven


temperature welding reliability is not consistent.


Pad design


It is forbidden to design through holes for the non-thermal pads of the device.


Surface treatment


ENIG surface treatment is preferred. For hotbar pads, oSP surface treatment is prohibited.


PCB thickness design


The PCB thickness of SFP and XFP optical modules must be 1.0mm. (The 1.0mm thickness required by SFP and XFP is


specified by the MSA agreement)For pcb technical questions, Lingtech PCB’s knowledgeable support team is always available to help you.


You can also request a PCB quotation here.Please contact us.  We will respond very quickly.


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