Solder Paste Inspection
LingtechPCB SMT production has deployed automatic SPI machine to check the solder paste printing quality,
to ensure best soldering quality.
SPI, the full name of solder paste inspection, is an SMT inspection device that uses optical principles to calculate the height of the
solder paste printed on the PCB by triangulation. It is the quality inspection of solder printing and the verification and control of the
1.The function of SPI:
quality is out of range, For example, the control parameters of the printing machine, human factors, solder paste change
factors, etc. Then we can make timely adjustments to control the continued spread of trends.
2.What to be detected:
Height, volume, area, position misalignment, diffusion, missing, breakage, height deviation (tip)
3.The difference between SPI & AOI:
(1) After the solder paste is printed, before the SMT machine, pass through the solder paste inspection machine (with a laser device that can detect
the thickness of the solder paste).
(2) Following the placement machine, AOI is component placement inspection (before reflow soldering) and
solder joint inspection (after reflow soldering).